Ultrasonic Non-Destructive Evaluation of Adhesive Thin Layer

Ultrasonic Non-Destructive Evaluation of Adhesive Thin Layer

Author(s):

Publication title:

2006 AIChE annual meeting, November 12-17, 2006, San Francisco, California, San Francisco Hilton : conference proceedings. Non-topical conferences

Title of ser.:

AIChE Conference Proceedings

Ser. no.:

P-235

Pub. Year:

2006

Pt.:

8

Pub. info.:

New York: American Institute of Chemical Engineers

ISBN:

9780816910120 [081691012X]

Language:

English

Call no.:

A08000/2006 [CD-ROM]

Type:

Conference Proceedings

Details

TDL ID:	ZA00061211
Series ID:	PA00000008
Conf. info. (Name):	AIChE Annual Meeting ; Particle Technology Forum ; North American Mixing Forum ; Computational Molecular Science and Engineering Forum ; Nanoscale Science and Engineering Forum ; Sustainable Engineering Forum
Conf. info. (Number):	2006
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2006.11.12-2006.11.17
Note for article:	AIChE annual meeting conference, November 12-17, 2006, San Francisco, CA. Materials Engineering and Sciences Division

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