Blank Cover Image

Planar Copper Electrodeposition And Electropolishing Techniques

Author(s):
Publication title:
03 AIChE annlual meeting, November 16-21, San Francisco, California, AIChE 2003 annual meeting conference proceedings
Title of ser.:
AIChE Conference Proceedings
Ser. no.:
P-201
Pub. Year:
2003
Page(from):
192a
Pages:
10
Pub. info.:
New York: American Institute of Chemical Engineers
ISBN:
9780816909414 [0816909415]
Language:
English
Call no.:
A08000/2003 [CD-ROM]
Type:
Conference Proceedings

Similar Items:

Bülent Basol, Cyprian Uzoh, Homayoun Talieh, Tony Wang, George Guo

American Institute of Chemical Engineers

Du, B., Suni, I.I.

Electrochemical Society

Uzoh, C.E., Wang, T., Talieh, H., Basol, B.M.

Electrochemical Society

P. Hlubina, D. Cyprian, M. Kadulova

Society of Photo-optical Instrumentation Engineers

Basol, B.M., Uzoh, C.E., Wang, T.

Electrochemical Society

Guo, He-Tong, Qin, Qi-Xian, Wang, Ai-Mei

American Institute of Chemical Engineers

S. Aksu, I. Emesh, C. Uzoh, B. Basol

Electrochemical Society

10 Conference Proceedings Electrodeposition of Paint

Brewer, George E. F.

American Chemical Society

Basol, Bulent N., Kapur, Vijay K.

American Institute of Chemical Engineers

Tian, Y., Suni, I.I.

Electrochemical Society

Basol, Bulent M., Kapur, Vijay K.

MRS - Materials Research Society

Andriacacos, P.C., Uzoh, C., Dukovic, J.O., Horkans, J., Deligianni, H.

Electrochemical Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12