A Wafer-scale Removal Rate Model For Chemical Mechanical Planarization

A Wafer-scale Removal Rate Model For Chemical Mechanical Planarization

Author(s):: John Kelchner
Publication title:: 03 AIChE annlual meeting, November 16-21, San Francisco, California, AIChE 2003 annual meeting conference proceedings
Title of ser.:: AIChE Conference Proceedings
Ser. no.:: P-201
Pub. Year:: 2003
Page(from):: 191e
Pages:: 5
Pub. info.:: New York: American Institute of Chemical Engineers
ISBN:: 9780816909414 [0816909415]
Language:: English
Call no.:: A08000/2003 [CD-ROM]
Type:: Conference Proceedings

Details

TDL ID:	ZA00061142
Series ID:	PA00000008
Conf. info. (Name):	AIChE Annual Meeting
Conf. info. (Number):	2003
Conf. info. (Venue):	San Francisco, CA, USA
Conf. info. (Date):	2003.11.16-2003.11.21
Note for article:	2003 Annual Meeting, San Francisco, California November 16-21, 2003

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