Electroplating of ZnO Influenced by the Concentration of Aluminum Nitrate in the Bath

Electroplating of ZnO Influenced by the Concentration of Aluminum Nitrate in the Bath

Author(s):

Publication title:

Materials Science and Nanotechnology II

Title of ser.:

Materials science forum

Ser. no.:

863

Pub. Year:

2016

Page(from):

102

Page(to):

110

Pages:

9

Pub. info.:

Stafa-Zuerich: Trans Tech Publications

ISSN:

02555476

ISBN:

9783038357100 [3038357103]

Language:

English

Call no.:

M23650 [v.863]

Type:

Conference Proceedings

Details

TDL ID:	ZA00057961
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Materials Science and Nanotechnology
Conf. info. (Number):	2016
Conf. info. (Venue):	Seoul, South Korea
Conf. info. (Date):	2016.05.12-2016.05.14
Note for article:	2016 International Conference on Materials Science and Nanotechnology, May 12-14, 2016, Seoul, South Korea

Similar Items:

1 Conference Proceedings Magnetic Properties of Copper Laminated Magnetic CoFeCu Films Deposited from a Single Plating Bath by Current Modulation Trouilloud, P., Romankiw, L.T., Chang, J.-W., Lin, K.C. Electrochemical Society	7 Conference Proceedings Microtexture and Strain in Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society
2 Conference Proceedings Characterization of hydrogen sensors based on palladium-electroplated fiber Bragg gratings(FBG) Peng,Y.T., Tang,Y., Sirkis,J.S. SPIE - The International Society for Optical Engineering	8 Conference Proceedings Influence of Autogenous Shrinkage and early Anti-Cracking Behavior of USHC with Pretreatment RHA X. Wu, Y. Peng, W.Q. Li, S. Wang, J.C. Lin Trans Tech Publications
3 Conference Proceedings Properties of Indium Tin Oxide/Amorphous Alloys Bi-Layer Films as Transparent Electrodes H.K. Lin, K.C. Cheng, T.P. Cho, J.C. Huang Trans Tech Publications	9 Conference Proceedings Influence of Autogenous Shrinkage and early Anti-Cracking Behavior of USHC with Pretreatment RHA X. Wu, Y. Peng, W.Q. Li, S. Wang, J.C. Lin Trans Tech Publications
4 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Gross, M. E., Drese, R., Lingk, C., Brown, W. L., Evans-Lutterodt, K., Barr, D., Golovin, D., Ritzdorf, T., Turner, J., … MRS - Materials Research Society	10 Conference Proceedings Micro-Anode Guided Electroplating (MAGE) Control System Lee, D.L., Lin, J.C., Kao, P.P., Jiang, S.B. Trans Tech Publications
5 Conference Proceedings Electroplated Damascene Copper: Process Influences on Recrystallization and Texture Barr, D., Brown, W. L., Drese, R., Evans-Lutterodt, K., Golovin, D., Graham, L., Gross, M. E., Lingk, C., Ritzdorf, T., … Materials Research Society	11 Conference Proceedings EXPERIMENTAL DETERMINATION OF THE Ti-Nb-Al PHASE DIAGRAM AT 1200°C Jewett, T.J., Lin, J.C., Bonda, N.R., Seitzman, L.E., Hsieh, K.C., Chang, Y.A., Perepezko, J.H. Materials Research Society
6 Conference Proceedings Microtexture And Strain In Electroplated Copper Interconnects Spolenak, R., Barr, D.L., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Tamura, N., Macdowell, A.A., Celestre, R.S., … Materials Research Society	12 Conference Proceedings Enhanced Hydrogen Storage in MWCNTs Decorated by Electroless Nickel Nanoparticles Deposited in Supercritical CO₂ Bath C.Y. Chen, J.K. Chang, K.Y. Lin, S.T. Chung, W.T. Tsai Trans Tech Publications

1

2

3

4

5

6

7

8

9

10

11

12