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Atomistic Study of the Copper Cluster Deposition on Si(001) and Si(111) Surface

Author(s):
Publication title:
Methods of Design and Characterization of Materials, Research and Development of Technological Processes : selected, peer reviewed papers from the Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China
Title of ser.:
Materials science forum
Ser. no.:
850
Pub. Year:
2016
Page(from):
287
Page(to):
298
Pages:
12
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783038357629 [3038357626]
Language:
English
Call no.:
M23650 [v.850]
Type:
Conference Proceedings

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