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Replacement of High-Purity Copper Target by High-Purity Copper Alloy Target in Very Large Scale Integrated Circuit

Author(s):
Publication title:
Functional and Functionally Structured Materials : Selected, peer reviewed papers from the Chinese Materials Conference 2015, July 10-14, 2015, Guiyang, China
Title of ser.:
Materials science forum
Ser. no.:
848
Pub. Year:
2016
Page(from):
430
Page(to):
434
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
ISBN:
9783038357605 [303835760X]
Language:
English
Call no.:
M23650 [v.848]
Type:
Conference Proceedings

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