Nanoscale Dynamic Mechanical Analysis on Heat-Resistant Silsesquioxane Nanocomposite for Power-Device Packaging
- Author(s):
- Publication title:
- Silicon Carbide and Related Materials 2014 : Selected peer reviewed papers from the European Conference on Silicon Carbide & Related Materials (ECSCRM 2014), September 21-25, 2014, Grenoble, France
- Title of ser.:
- Materials science forum
- Ser. no.:
- 821-823
- Pub. Year:
- 2015
- Page(from):
- 923
- Page(to):
- 928
- Pages:
- 6
- Pub. info.:
- Aedermannsdorf, Switzerland: Trans Tech Publications
- ISSN:
- 02555476
- Language:
- English
- Call no.:
- M23650
- Type:
- Conference Proceedings
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