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Effect of Ag Addition on Growth of the Interfacial Intermetallic Compounds between Sn-0.7Cu Solder and Cu Substrate

Author(s):
Publication title:
Advanced Functional Materials : Selected, peer reviewed papers from the Chinese Materials Congress 2014 (CMC 2014), July 4-7, 2014, Chengdu, China
Title of ser.:
Materials science forum
Ser. no.:
815
Pub. Year:
2015
Page(from):
129
Page(to):
134
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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