Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

Diffusion Bonding of Duplex Stainless Steel and Ti Alloy with and without Interlayer

Author(s):

Publication title:

THERMEC 2013 : Selected, peer reviewed papers from the 8th International Conference on PROCESSING & MANUFACTURING OF ADVANCED MATERIALS Processing, Fabrication, Properties, Applications, December 2-6, 2013, Las Vegas, USA

Title of ser.:

Materials science forum

Ser. no.:

783-786

Pub. Year:

2014

Pt.:

1

Page(from):

9

Page(to):

14

Pages:

6

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054256
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Processing & Manufacturing Of Advanced Materials
Conf. info. (Number):	8th
Conf. info. (Venue):	Las Vegas, USA
Conf. info. (Date):	2013.12.02-2013.12.06
Note for article:	8th International Conference on Processing & Manufacturing of Advanced Materials Processing, Fabrication, Properties, Applications, December 2-6, 2013, Las Vegas, USA

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