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Effect of the Bonding Temperature on the Bonding Interface in the Press Bonding of Ti-17 Alloy

Author(s):
Publication title:
Advances in Materials and Processing Technologies XV : Selected, peer reviewed papers from the 15th International Conference on Advances in Materials and Processing Technologies (AMPT 2012), September 23-26, 2012, Wollongong, Australia
Title of ser.:
Materials science forum
Ser. no.:
773-774
Pub. Year:
2014
Page(from):
732
Page(to):
740
Pages:
9
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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