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Micro-Displacement, Stain and Stress Measurement Based on Electronic Speckle Pattern Interferometry

Author(s):
Publication title:
Advances in materials manufacturing science and technology XV : selected, peer reviewed papers from the 15th International Manufacturing Conference in China (15th IMCC), October 16-18, 2013, Nanjing, China
Title of ser.:
Materials science forum
Ser. no.:
770
Pub. Year:
2014
Page(from):
267
Page(to):
271
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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