Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

Analysis of Bonging Temperature and Interfacial Characterization of 3Y-TZP and SUS304 by Diffusion Bonding

Author(s):

Publication title:

Advanced Materials Science and Technology : Selected, peer reviewed papers from the 8th International Forum on Advanced Materials Science and Technology (IFAMST 8) August 1-4, 2012, Fukuoka Institute of Technology, Japan

Title of ser.:

Materials science forum

Ser. no.:

750

Pub. Year:

2013

Page(from):

164

Page(to):

167

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054228
Series ID:	PA00000012
Conf. info. (Name):	International Forum on Advanced Materials Science and Technology (IFAMST 8)
Conf. info. (Number):	8th
Conf. info. (Venue):	Fukuoka, Japan
Conf. info. (Date):	2012.08.01-2012.08.04
Note for article:	8th International Forum on Advanced Materials Science and Technology (IFAMST 8) August 1-4, 2012, Fukuoka Institute of Technology, Japan

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