Heat Transfer Performance of Lotus-Type Porous Copper Micro-Channel Heat Sink

Heat Transfer Performance of Lotus-Type Porous Copper Micro-Channel Heat Sink

Author(s):

Publication title:

Materials performance, modeling and simulation : selected peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China

Title of ser.:

Materials science forum

Ser. no.:

749

Pub. Year:

2013

Page(from):

414

Page(to):

420

Pages:

7

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054227
Series ID:	PA00000012
Conf. info. (Name):	Chinese Materials Congress (CMC 2012)
Conf. info. (Number):	2012
Conf. info. (Venue):	Taiyuan, China
Conf. info. (Date):	2012.07.13-2012.07.18
Note for article:	Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China

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