Blank Cover Image

Preparation of Tungsten-Copper Composite Powder by Electroless Plating

Author(s):
Publication title:
Materials performance, modeling and simulation : selected peer reviewed papers from the Chinese Materials Congress 2012 (CMC 2012), July 13-18, 2012, Taiyuan, China
Title of ser.:
Materials science forum
Ser. no.:
749
Pub. Year:
2013
Page(from):
28
Page(to):
34
Pages:
7
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

J.Q. Hou, L.R. Xiao, L. Guo, S.S. Zhou, R.F. Wang

Trans Tech Publications

J.H. Lee

Trans Tech Publications

Y. Wang, W.C. Sun, H. Cai, Q.H. Yang, J.M. Zhang

Trans Tech Publications

Shimauchi, H., Ozawa, S., Osaka, T.

Electrochemical Society

Ahn, J. G., Kim, D. J., Hai, H. T., Lee, J., Chung, H. S., Kim, C. O.

Trans Tech Publications

Y. Guo, Q.H. Zhang, L.R. Wang, W.Z. Lu, L.J. Wang

Trans Tech Publications

Kiang, M. H., Tao, J.,, Namgoong, W., Hu, C, Lieberman, M., Cheung, N. W., Kang, H.-K., Wong. S. S.

Materials Research Society

Z.L. Lu, L.M. Luo, J. Zhang, Y.Q. Qin, X.M. Huang

Trans Tech Publications

Kiang, M.H., Tao, J., Namgoong, W., Hu, C., Lieberman, M., Cheung, N. W., Kang, H.-K., Wong, S. S.

Materials Research Society

H. Yuan, Y. Zhang, A.V. Ganeev, J.T. Wang, I.V. Alexandrov

Trans Tech Publications

B.Y. Wang, Q.H. Shi, W.L. Zhang

Trans Tech Publications

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12