Grain Boundary Triple Line Tension in Copper

Grain Boundary Triple Line Tension in Copper

Author(s):

Publication title:

Recrystallization and grain growth IV : selected peer reviewed papers from the Fourth International Conference on Recrystallization and Grain Growth (ReX & GG 2010), July 4-9, 2010, Sheffield, U.K.

Title of ser.:

Materials science forum

Ser. no.:

715-716

Pub. Year:

2012

Page(from):

843

Page(to):

848

Pages:

6

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054206
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Recrystallization and Grain Growth (ReX & GG 2010)
Conf. info. (Number):	4th
Conf. info. (Venue):	Sheffield, U.K.
Conf. info. (Date):	2010.07.04-2010.07.09
Note for article:	4th International Conference on Recrystallization and Grain Growth (ReX & GG 2010), July 4-9, 2010, Sheffield, U.K.

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