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Low Temperature Sintering Bonding Process Using Ag Nanoparticles Derived from Ag2O for Packaging of High-Temperature Electronics

Author(s):
Publication title:
THERMEC 2011 : International Conference on Processing & Manufacturing of Advanced Materials : processing, fabrication, properties, applications, August 1-5, 2011, Quebec City, Canada
Title of ser.:
Materials science forum
Ser. no.:
706-709
Pub. Year:
2012
Pt.:
4
Page(from):
2962
Page(to):
2967
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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