The Morphology and Evolution of Cu6Sn5 at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

The Morphology and Evolution of Cu₆Sn₅ at the Interface of Sn-2.5Ag-0.7Cu-0.1RE/Cu Solder Joint during the Isothermal Aging

Author(s):

Publication title:

Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China

Title of ser.:

Materials science forum

Ser. no.:

704-705

Pub. Year:

2012

Pt.:

1

Page(from):

685

Page(to):

689

Pages:

5

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054199
Series ID:	PA00000012
Conf. info. (Name):	International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010)
Conf. info. (Number):	6th
Conf. info. (Venue):	Guilin, China
Conf. info. (Date):	2010.11.16-2010.11.19
Note for article:	6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China

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