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High Temperature Deformation Behavior and Microstructure Preparation of Cu-Ni-Si-P Alloy

Author(s):
Publication title:
Physical and Numerical Simulation of Material Processing VI : Selected, peer reviewed papers from the 6th International Conference on Physical and Numerical Simulation of Materials Processing (ICPNS 2010), November 16-19, 2010, Guilin, China
Title of ser.:
Materials science forum
Ser. no.:
704-705
Pub. Year:
2012
Pt.:
1
Page(from):
135
Page(to):
140
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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