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Effect of RE on Creep Rupture Life of SnAgCu Solder Joints

Author(s):
Publication title:
Functional and electronic materials : selected, peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China
Title of ser.:
Materials science forum
Ser. no.:
687
Pub. Year:
2011
Page(from):
39
Page(to):
43
Pages:
5
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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