Blank Cover Image

Effect of the LaNd Addition on Melting Point and Spreading Properties of Bi5Sb8Sn Solder Alloy

Author(s):
Publication title:
Advanced structural materials : selected peer reviewed papers from IUMRS-ICA 2010, 11th IUMRS International Conference in Asia, 25-28 September 2010, Qingdao, China
Title of ser.:
Materials science forum
Ser. no.:
686
Pub. Year:
2011
Page(from):
488
Page(to):
493
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Effect of the Content of LaNd on Physical Properties and Solderability of Zn20Sn6Cu Solder

K.L. Zhao, Y.F. Yan, Y.B. Li

Trans Tech Publications
7 Conference Proceedings Effect on properties of 425n58Bi solder joint by adding the 96.5Sn3.5Ag

Tang,Q., Pan,X., Wu,C.M.L., Chan,Y.C.

SPIE - The International Society for Optical Engineering
2 Conference Proceedings Effect of the Content of Cu on Solderability and Mechanical Properties of Bi5Sb Solder Alloy

Y.F. Yan, L.F. Feng, X.X. Guo, K. Tang, K.X. Song

Trans Tech Publications
8 Conference Proceedings Effect of the Bi Content on the Mechanical Properties of a Sn-Zn-Al-Bi Solder Alloy

Soares, D., Vilarinho, C., Barbosa, J., Silva, R., Pinho, M., Castro, F.

Trans Tech Publications
3 Conference Proceedings Effect of the Er on Resistivity and Spreading Properties of Bi5Sb8Sn Solder Alloy

Li, Shuai, Yan, Yan Fu, Feng, Li Fang, Wang, Hong Na

Trans Tech Publications
9 Conference Proceedings Effect of High Density Pulsing Current on Mechanical Properties of Fe-6.5wt.%Si Alloy Sheet

H.C. Zhou, Y.F. Liang, F. Ye, G.Y. Tang, J.P. Lin

Trans Tech Publications
4 Conference Proceedings Sn-2.5Ag-0.7Cu-0.1Re-xNi Lead-Free Solder Alloy and its Creep Properties of Solder Joints

K.K. Zhang, Y.L. Wang, Y.L. Fan, G.J. Zhao, Y.F. Yan

Trans Tech Publications
10 Conference Proceedings Effect of Ag Particles on Wettability and Creep Rupture Life of SnCu Based Composite Solders

Y.F. Yan, G.X. Wang, K.X. Song, K.I. Zhao

Trans Tech Publications
5 Conference Proceedings Effect of High Density Electropulsing Current on Microstructure and Mechanical Properties of Fe-6.5wt.%Si Alloy Sheet

Y.Y. Liu, Y.F. Liang, S.B. Wen, F. Ye, J.P. Lin

Trans Tech Publications
11 Conference Proceedings Effect of Zn Addition on Microstructure and Mechanical Properties after Extrusion, Rolling and Ageing in Mg-9Gd-3Y-0.5Zr Alloys

W.N. Tang, S.Q. Li, R.S. Chen, E.H. Han, W. Ke

Trans Tech Publications
6 Conference Proceedings Effect of Bi Addition on Microstructures, Properties and Interfacial Intermetallic Compound Growth of Low-Ag Sn-Cu Lead-Free Solder

Y. Wang, X.C. Zhao, Y. Liu, J.W. Cheng, H. Li

Trans Tech Publications
12 Conference Proceedings Preparation and Properties of SiC/Phenolic Resin for the Heat of LED

C. Wu, K. Zhao, Y.F. Tang, J.Y. Ma

Trans Tech Publications
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12