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Thickness Effect on Microstructure and Residual Stress of Annealed Copper Thin Films

Author(s):
Publication title:
Residual stresses VIII : selected, peer reviewed papers from the 8th European Conference on Residual Stresses, ECRS8, 2010, June 26-28, 2010, Riva del Garda, Italy
Title of ser.:
Materials science forum
Ser. no.:
681
Pub. Year:
2011
Page(from):
139
Page(to):
144
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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