Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy

Effects of the Cooling Rate on the Solidification Microstructure of Cu-Ni Alloy

Author(s):

Publication title:

Eco-materials processing and design XI : ISEPD-11 : selected, peer reviewed papers from the 11th International Symposium on Eco-Materials Processing and Design, Osaka, Japan, January 9-12, 2010

Title of ser.:

Materials science forum

Ser. no.:

658

Pub. Year:

2010

Page(from):

444

Page(to):

447

Pages:

4

Pub. info.:

Aedermannsdorf, Switzerland: Trans Tech Publications

ISSN:

02555476

Language:

English

Call no.:

M23650

Type:

Conference Proceedings

Details

TDL ID:	ZA00054163
Series ID:	PA00000012
Conf. info. (Name):	International Symposium on Eco-Materials Processing and Design
Conf. info. (Number):	11th
Conf. info. (Venue):	Osaka, Japan
Conf. info. (Date):	2010.01.09-2010.01.12
Note for article:	11th International Symposium on Eco-Materials Processing and Design, Osaka, Japan, January 9-12, 2010

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