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Underfill Injection Molding in Flip-Chip Packaging with Different Bumps Array Arrangements

Author(s):
Publication title:
Advanced manufacture : focusing on new and emerging technologies : selected peer reviewed papers from the 2007 International Conference on Advanced Manufacture, Tainan, Taiwan, R.O.C., November 26-November 28, 2007
Title of ser.:
Materials science forum
Ser. no.:
594
Pub. Year:
2008
Page(from):
163
Page(to):
168
Pages:
6
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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