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Thermal Resistance Control of an Optical Module Packaging by a Heat Sink of High Thermal Conductivity

Author(s):
Publication title:
Advanced welding and micro joining/packaging for the 21st century : selected peer reviewed papers from the International Welding/Joining Conference, Korea 2007 (IWJC, Korea 2007), which was held from 10th-12th May 2007 at COEX, Seoul, Korea
Title of ser.:
Materials science forum
Ser. no.:
580-582
Pub. Year:
2008
Page(from):
163
Page(to):
166
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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