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Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns

Author(s):
Publication title:
Eco-materials processing and design IX : selected, peer reviewed papers from 9th International Symposium on Eco-Materials Processing and Design, Changwon Convention Centre, Changwon City, Korea, January 07-09, 2008
Title of ser.:
Materials science forum
Ser. no.:
569
Pub. Year:
2008
Page(from):
117
Page(to):
120
Pages:
4
Pub. info.:
Aedermannsdorf, Switzerland: Trans Tech Publications
ISSN:
02555476
Language:
English
Call no.:
M23650
Type:
Conference Proceedings

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