Alignment and overlay metrology issues for copper/low-K dual-damascene interconnect

Alignment and overlay metrology issues for copper/low-K dual-damascene interconnect

Author(s):

Publication title:

Metrology, inspection, and process control for microlithography XIII : 15-18 March, 1999, Santa Clara, California

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

3677

Pub. Year:

1999

Vol.:

1

Page(from):

107

Page(to):

115

Pages:

9

Pub. info.:

Bellingham, Wash.: SPIE - The International Society of Optical Engineering

ISSN:

0277786X

ISBN:

9780819431516 [0819431516]

Language:

English

Call no.:

P63600/3677

Type:

Conference Proceedings

Details

TDL ID:	ZA00052894
Series ID:	PA00000029
Conf. info. (Name):	Metrology, inspection, and process control for microlithography
Conf. info. (Number):	13th
Conf. info. (Venue):	Santa Clara, California, USA
Conf. info. (Date):	1999.03.15-1999.03.18
Note for article:	Metrology, Inspection, and Process Control for Microlithography XIII, Santa Clara, California, USA, March 15-18, 1999

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