The Effect of Process Parameters on CVD Cu Seed Layer Deposition on Ru and Ta Under-layer

The Effect of Process Parameters on CVD Cu Seed Layer Deposition on Ru and Ta Under-layer

Author(s):

Publication title:

Fundamental Gas-Phase and Surface Chemistry of Vapor-Phase Materials Processing 3

Title of ser.:

ECS transactions

Ser. no.:

2(7)

Pub. Year:

2007

Page(from):

157

Page(to):

165

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775182 [1566775183]

Language:

English

Call no.:

E23400/2-7 [7]

Type:

Conference Proceedings

Details

TDL ID:	ZA00046580
Series ID:	PA00000034
Conf. info. (Name):	ECS Meeting
Conf. info. (Number):	209th
Conf. info. (Venue):	Denver, Colorado, USA
Conf. info. (Date):	2006.05.07-2006.05.12
Note for article:	209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado

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