Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films

Electrochemical Mechanical Planarization (eCMP) of Copper Thin Films

Author(s):

Publication title:

Electrochemical Processing in ULSI and MEMS 2

Title of ser.:

ECS transactions

Ser. no.:

2(6)

Pub. Year:

2007

Page(from):

417

Page(to):

425

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775175 [1566775175]

Language:

English

Call no.:

E23400/2-6

Type:

Conference Proceedings

Details

TDL ID:	ZA00046579
Series ID:	PA00000034
Conf. info. (Name):	ECS Meeting
Conf. info. (Number):	209th
Conf. info. (Venue):	Denver, Colorado, USA
Conf. info. (Date):	2006.05.07-2006.05.12
Note for article:	209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado

Similar Items:

1 Conference Proceedings Study on the Mechanism of Electrochemical Mechanical Deposition of Copper Layers Basol, B.M., Uzoh, C.E., Wang, T. Electrochemical Society	7 Conference Proceedings Development of Electrochemical Mechanical Polishing for Advanced Copper Planarization R. Jia, Y. Wang, Z. Wang, S. Tsai, J. Dma, D. Mao, L. Karuppiah, L. Chen Electrochemical Society
2 Conference Proceedings Potential-pH Diagrams of Interest to Chemical Mechanical Planarization of Copper Thin Films Aksu, Serdar Materials Research Society	8 Conference Proceedings Planar Copper Electrodeposition And Electropolishing Techniques Bülent Basol, Cyprian Uzoh, Homayoun Talieh, Tony Wang, George Guo American Institute of Chemical Engineers
3 Conference Proceedings Role of Phosphoric Acid in Copper Electrochemical Mechanical Planarization Slurries Serdar Aksu Materials Research Society	9 Conference Proceedings Planar Copper Electrodeposition And Electropolishing Techniques Bülent Basol, Cyprian Uzoh, Homayoun Talieh, Tony Wang, George Guo American Institute of Chemical Engineers
4 Conference Proceedings Electrochemistry of Copper in the Chemical Mechanical Planarization (CMP) Slurries Containing Glycine and Hydrogen Peroxide Aksu, S., Doyle, F.M. Electrochemical Society	10 Conference Proceedings MECHANICAL PROPERTIES OF MULTILAYERED COPPER-NICKEL THIN FILMS MEASURED BY INDENTATION TECHNIQUES Schlesinger, T. E., cammarata, R. C., Kim, C., Qadri, S. B., Edelstein, A. S. Materials Research Society
5 Conference Proceedings Two-Step Planarization of ECMP and CMP for MEMS Copper Patterns S.H. Jeong, S.B. Joo, H.J. Lee, B.Y. Park, H.J. Kim Trans Tech Publications	11 Conference Proceedings Role of Oxidizer and Inhibitor on Chemical Mechanical Planarization of Copper Kuiry, S.C., Seal, S. Electrochemical Society
6 Conference Proceedings Electrochemical Considerations During Chemical-Mechanical Planarization of Copper Sainio, C., Diquette, D.J. Electrochemical Society	12 Conference Proceedings Advances in Multilevel Interconnect Technology Uzoh, C.E., Wang, T., Talieh, H., Basol, B.M. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12