Electrically Mediated Copper Electrodeposition for Interconnect Applications

Electrically Mediated Copper Electrodeposition for Interconnect Applications

Author(s):

Publication title:

Electrochemical Processing in ULSI and MEMS 2

Title of ser.:

ECS transactions

Ser. no.:

2(6)

Pub. Year:

2007

Page(from):

149

Page(to):

156

Pages:

8

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775175 [1566775175]

Language:

English

Call no.:

E23400/2-6

Type:

Conference Proceedings

Details

TDL ID:	ZA00046579
Series ID:	PA00000034
Conf. info. (Name):	ECS Meeting
Conf. info. (Number):	209th
Conf. info. (Venue):	Denver, Colorado, USA
Conf. info. (Date):	2006.05.07-2006.05.12
Note for article:	209th ECS Meeting, May 7-May 12, 2006, Denver, Colorado

Similar Items:

1 Conference Proceedings Controlling Whisker Formation in Tin-Based Solders Using Electrically Mediated Electrodeposition H. Garich, H. McCrabb, E.J. Taylor, M. Inman Electrochemical Society	7 Conference Proceedings Modulated Reverse Electric Field Copper Metallization for High Density Interconnect and Very Large Scale Integration Applications Sun, J.J., Taylor, E.J., Leedy, K.D., Via, G.D., O'Keefe, M.J., Inman, M.E., Zhou, C.D. Electrochemical Society
2 Conference Proceedings Simulation and Experimental Results for Copper Deposition in a Moving Wafer Tool to Minimize Terminal Effects H. McCrabb, J. Lee, E.J. Taylor, R. Carpio Electrochemical Society	8 Conference Proceedings Advanced optical characterization techniques for borophosphosilicate films Carpio,R.A., Taylor,J. SPIE-The International Society for Optical Engineering
3 Conference Proceedings Determination of Diffusion Boundary Layers and Copper Thickness Uniformity in Plating Tools Designed for 3-D Interconnect and Packaging Applications H. McCrabb, H. Garich, L. Gebhart, M. Inman, E.J. Taylor Electrochemical Society	9 Conference Proceedings Superconformal Electrodeposition of Copper Moffat, T.P., Bonevich, J.E., Huber, W.H., Stanishevshky, A, Kelly, D.R., Stafford, G.R., Josell, D. Electrochemical Society
4 Conference Proceedings Development and Characterization of Plating Cell Geometry for PCB and Packaging Applications. H. Garich, L. Gebhart, E.J. Taylor, M. Inman, H. McCrabb Electrochemical Society	10 Conference Proceedings A Sequential Copper Plating Process for Multiple Feature Sizes for HDI Applications Sun, J.J., Taylor, E.J., Inman, M.E. Electrochemical Society
5 Conference Proceedings Electrically Mediated Process for Functinal and Decorative Trivalent Chromium Electroplating: An Alternative to Hexavalent Chromium A. Lozano-Morales, R. Renz, J. Fortman, E.J. Taylor Electrochemical Society	11 Conference Proceedings Electrical Characteristics of CVD Copper Interconnects and Vias Nguyen, T., Ono, Y., Evans, D.R., Senzaki, Y., Kobayashi, M., Charmeski, L.J., Ulrich, B.D., Hsu, S.T. Electrochemical Society
6 Conference Proceedings Process-structure-property interrelationships of copper for electronic applications Woodman, A.S., Taylor, E.J., Anderson, E.B., Weil, R., Hong, S., Knapke, D.H., Fisher, G.L. Electrochemical Society	12 Conference Proceedings Influence of Leveling Agents on Surface Roughness of Electrodeposited Copper Films Witt, C., Srinivasan, J., Carpio, R. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12