Advanced Electrochemical Processes for Sub-50 nm On-chip Metallization
- Author(s):
- Publication title:
- Electrochemical Processing in ULSI and MEMS 2
- Title of ser.:
- ECS transactions
- Ser. no.:
- 2(6)
- Pub. Year:
- 2007
- Page(from):
- 13
- Page(to):
- 18
- Pages:
- 6
- Pub. info.:
- Pennington, N.J.: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566775175 [1566775175]
- Language:
- English
- Call no.:
- E23400/2-6
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
7
Conference Proceedings
REAP (raster e-beam advanced process) using 50-kV raster e-beam system for sub-100-nm node mask technology
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
3
Conference Proceedings
29. Fundamental Shift in ULSI Interconnect Technology - Electrochemical Deposition of Cu for on Chip Interconnects
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
American Institute of Chemical Engineers |
Trans Tech Publications |
American Institute of Chemical Engineers |
MRS - Materials Research Society |
6
Conference Proceedings
Analysis of the Bottom-up Fill during Copper Metallization of Semiconductor Interconnects
Electrochemical Society |
SPIE - The International Society of Optical Engineering |