Blank Cover Image

Direct Wafer Bonding Enhanced by Ductile Layers Inserted Near the Interface

Author(s):
Publication title:
Semiconductor wafer bonding 9 : science, technology, and applications
Title of ser.:
ECS transactions
Ser. no.:
3(6)
Pub. Year:
2006
Page(from):
279
Page(to):
289
Pages:
11
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775069 [156677506X]
Language:
English
Call no.:
E23400/3-6
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Influence of a Ductile Interlayer on the Toughness of Hydrophilic Wafer Bonding

Bertholet, Y., Raskin, J.P., Pardoen, T.

Electrochemical Society
7 Conference Proceedings New Generation of Structures Obtained by Direct Wafer Bonding of Processed Wafers

B. Aspar, C. Lagahe-Blanchard, N. Sousbie, J. Margail, H. Moriceau

Electrochemical Society
2 Conference Proceedings Fabrication and Characterization of High Resistivity SOI Wafers for RF Applications

D.C. Lederer, C.R. Neve, B. Olbrechts, J. Raskin

Electrochemical Society
8 Conference Proceedings Ductility of Thin Metallic Films

T. Pardoen, M. Coulombier, A. Boe, A. Safi, C. Brugger

Trans Tech Publications
3 Conference Proceedings Thin Film Transfer for the Fabrication of Multiple Gate MOS Transistors

B. Olbrechts, U. Södervall, S. Bengtsson, J. Raskin

Electrochemical Society
9 Conference Proceedings Mechanistic Studies of Silicon Wafer Bonding and Layer Exfoliation

Weldon, M.K., Marsico, V.E., Chabal, Y.J., Agarwal, A., Eaglesham, D.J., Sapjeta, J., Brown, W.L., Jacobson, D.C., …

Electrochemical Society
4 Conference Proceedings Stress release of PECVD oxide by RTA

Charavel, R., Olbrechts, B., Raskin, J.-P.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Modelling of Ductile Fracture in the Presence of Two Populations of Voids - Applications to Aluminum Alloys

Fabregue, D., Lassance, D., Pardoen, T.

Trans Tech Publications
5 Conference Proceedings Characterizing the Effect of Uniaxial Strain on the Surface Roughness of Si Nanowire MEMS-Based Microstructures

E. Escobedo-Cousin, S.H. Olsen, T. Pardoen, U. Bhaskar, J.-P. Raskin

Materials Research Society
11 Conference Proceedings Direct Bonding of Oxidized Cavity Wafers

M.O. Palokangas, J. Dekker, K. Henttinen, J. Mäkinen

Electrochemical Society
6 Conference Proceedings WAFER BONDING FOR SOI

Maszara, W. P., Goetz, G., Caviglia, T., Cserhati, A., Johnson, G., McKitterick, J. B.

Materials Research Society
12 Conference Proceedings Layer Transfer onto a Dissimilar Material Substrate by Wafer Bonding and Layer Splitting

Lee, T.H., Tong, Q.-Y., Zhang, H.-Z., Ding, X.-F., Sin, J.K.O.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12