Blank Cover Image

Comparison of the Mechanical Properties of Low Temperature Bonded Test Samples

Author(s):
Publication title:
Semiconductor wafer bonding 9 : science, technology, and applications
Title of ser.:
ECS transactions
Ser. no.:
3(6)
Pub. Year:
2006
Page(from):
269
Page(to):
278
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775069 [156677506X]
Language:
English
Call no.:
E23400/3-6
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Mechanical Reliability of Directly Bonded Silicon MEMS Components

Bagdahn, J., Wiemer, M., Petzold, M.(Invited)

Electrochemical Society
7 Conference Proceedings Mechanical Characterization and Micro Structure Diagnostics of Glass Frit Bonded Interfaces

B. Boettge, C. Dresbach, A. Graff, M. Petzold, J. Bagdahn

Electrochemical Society
2 Conference Proceedings Measurement of the Local Strength Distribution of Directly Bonded Silicon Wafers using the Micro-Chevron Test

Bagdahn, J., Ploessl, A., Wiemer, M., Petzold, M.

Electrochemical Society
8 Conference Proceedings Strength assessment of wafer-bonded micromechanical components using the micro-chevron test

Petzold,M., Knoll,H., Bagdahn,J.

SPIE-The International Society for Optical Engineering
3 Conference Proceedings Laser Transmission Bonding of Silicon-to-Silicon and Silicon-to-Glass for Wafer Level Packaging and Microsystems

F. Sari, M. Wiemer, M. Bernasch, J. Bagdahn

Electrochemical Society
9 Conference Proceedings THE INTERFACE OF SILICON SAMPLES JOINED AT ROOM TEMPERATURE BY WAFER DIRECT BONDING IN ULTRAHIGH VACUUM

Ploessl, A., Scholz, R., Bagdahn, J., Stenzel, H., Tu, K.N., Goesele, U.M.

Electrochemical Society
4 Conference Proceedings Strength and long-term reliability testing of wafer-bonded MEMS

Petzold, M., Katzer, D., Wiemer, M., Bagdahn, J.

SPIE-The International Society for Optical Engineering
10 Conference Proceedings Characterisation of Directly Bonded Silicon Wafers by Means of the Double Cantilever Crack Opening Method

Bagdahn, J., Petzold, M., Reiche, M., Gutjahr, K.

Electrochemical Society
5 Conference Proceedings The Influence of Sharp Notches on the Strength of Directly Bonded Components

Bagdahn, J., Katzer, D., Petzold, M., Wiemer, M.

Electrochemical Society
11 Conference Proceedings Mechanical Properties of Refractory Metals at Extremely High Temperatures

B. Fischer, M. Beschliesser, A. Hoffmann, S. Vorberg

Trans Tech Publications
6 Conference Proceedings Lifetime Properties of Wafer-Bonded Components under Static and Cyclic Loading

Bagdahn, J., Petzold, M.

Electrochemical Society
12 Conference Proceedings MECHANICAL TESTING OF BONDED SILICON ON INSULATOR WAFERS

Farrens, S. N., Roberds, B., Boettcher, M. C., Ismail, M. S., Bowewr, R. W., Desmond, C. A., Hunt, C. E.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12