Blank Cover Image

Controlled Silicon (001) Surface Periodic Nanopatterning by Direct Wafer Bonding

Author(s):
Publication title:
Semiconductor wafer bonding 9 : science, technology, and applications
Title of ser.:
ECS transactions
Ser. no.:
3(6)
Pub. Year:
2006
Page(from):
261
Page(to):
267
Pages:
7
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775069 [156677506X]
Language:
English
Call no.:
E23400/3-6
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Ultra High Precision of the Tilt/Twist Misorientation Angles in Silicon/Silicon Direct Wafer Bonding

Fournel, F., Monceau, H., Leroy, F., Eymery, J., Gentile, P., Rosseau, K., Rouviere, J.-L.

Electrochemical Society
7 Conference Proceedings Low Temperature Wafer Bonding: Plasma Assisted Silicon Direct Bonding vs. Silicon-Gold Eutectic Bonding

M. Rabold, H. Kuster, P. Woias, F. Goldschmidtboeing

Electrochemical Society
2 Conference Proceedings Low Temperature Void Free Hydrophilic or Hydrophobic Silicon Direct Bonding

F. Fournel, H. Moriceau, R. Beneyton

Electrochemical Society
8 Conference Proceedings Bonding Organic Molecules to H-Terminated Silicon Wafers

Zazzera, L.A., Evans, J.F., Deruelle, M., Tirrell, M., Kessel, C.J., Mekeown, P.J.

Electrochemical Society
3 Conference Proceedings Effect of Pre-bonding Thermal Treatment on the Bonding Interface Evolution in Direct Si-Si Hydrophilic Wafer Bonding

C. Ventosa, F. Rieutord, L. Libralesso, F. Fournel, C. Morales

Electrochemical Society
9 Conference Proceedings VOID FORMATION AND ANNIHILATION IN SILICON DIRECT WAFER BONDING

Secco d'Aragona, F., Chiou, H-D.

Electrochemical Society
4 Conference Proceedings Effect of Prebonding Surface Treatments on Si-Si Direct Bonding : Bonding Void Decrease

R. Beneyton, F. Fournel, F. Rieutord, C. Morales, H. Moriceau

Electrochemical Society
10 Conference Proceedings A Study of Silicon Direct Wafer Bonding for MEMS Applications

d'Aragona, F.S., Iwamoto, T., Chiou, H.-D., Mirza, A.

Electrochemical Society
5 Conference Proceedings Dislocation Networks Strain Fields Induced by Si Wafer Bonding

Eymery, J., Fournel, F., Rousseau, K., Buttard, D., Leroy, F., Rieutord, F., Rouviere, J.L.

Materials Research Society
11 Conference Proceedings SILICON-SILICON DIRECT WAFER BONDING

D.L. Hughes

Electrochemical Society
6 Conference Proceedings Low Temperature Wafer Bonding

F. Fournel, H. Moriceau, C. Ventosa, L. Libralesso, Y. Le Tiec

Electrochemical Society
12 Conference Proceedings Strained Silicon on Insulator Wafers Made by the Smart CutTM Technology

Ghyselen, B., Bogumilowicz, Y., Aulnette, C., Abbadie, A., Osternaud, B., Besson, P., Daval, N., Andrieu, F., …

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12