Blank Cover Image

Plasma Assisted Low-Temperature Hydrophobic Wafer Bonding

Author(s):
Publication title:
Semiconductor wafer bonding 9 : science, technology, and applications
Title of ser.:
ECS transactions
Ser. no.:
3(6)
Pub. Year:
2006
Page(from):
181
Page(to):
188
Pages:
8
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
19385862
ISBN:
9781566775069 [156677506X]
Language:
English
Call no.:
E23400/3-6
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings UV Activation Treatment for Hydrophobic Wafer Bonding

Dang, H., Holl, S.L, Colinge, C.A., Hobart K.D., Kub, F.J.

Electrochemical Society
7 Conference Proceedings UV/Ozone Activation Treatment for Wafer Bonding

Hobart, K.D., Colinge, C.A., Ayele, G., Kub, F.J.

Electrochemical Society
2 Conference Proceedings Low Temperature Plasma-Assisted-Wafer-Bonding for MEMS

A. Sanz-Velasco, M. Bring, H. Rödjegaård, G.I. Andersson, P. Enoksson

Electrochemical Society
8 Conference Proceedings Creating Thin-Film Silicon on Flexible Substrates using Adhesive Bonding and Wet Etching

S. Song, S.L. Holl, C. Colinge, K. Byun, K.D. Hobart

Electrochemical Society
3 Conference Proceedings Low Temperature Wafer Bonding: Plasma Assisted Silicon Direct Bonding vs. Silicon-Gold Eutectic Bonding

M. Rabold, H. Kuster, P. Woias, F. Goldschmidtboeing

Electrochemical Society
9 Conference Proceedings A Comparison of Interfacial Fracture Energy of Bonded Wafers Using a Micro- Indentation and Crack Propagation Techniques

Colinge, C.A., Shaw, M.C., Esser, R.H., Hobart, K.D.

Electrochemical Society
4 Conference Proceedings Wafer Bonding using Oxygen Plasma Treatment in RIE and ICP RIE

Sanz-Velasco, A., Amirfeiz, P., Bengtsson, S., Colinge, C.

Electrochemical Society
10 Conference Proceedings Low Temperature Wafer Bonding

F. Fournel, H. Moriceau, C. Ventosa, L. Libralesso, Y. Le Tiec

Electrochemical Society
5 Conference Proceedings Fabrication Techniques for Thin-Film Silicon Layer Transfer

S. Holl, R. Varasala, H. Jawanda, C.A. Colinge, K.D. Hobart

Electrochemical Society
11 Conference Proceedings Method of localized and low-temperature wafer bonding for microsystem packaging

Shen,S.C., Pan,C.T., Chou,H.P.

SPIE-The International Society for Optical Engineering
6 Conference Proceedings Hydrophobic Low Temperature Wafer Bonding; Void Formation in the Oxide-Free Interface

Amirfeiz, P., Sanz-Velasco, A., Bengtsson, S.

Electrochemical Society
12 Conference Proceedings Plasma-activated wafer bonding: the new low-temperature tool for MEMS fabrication

V. Dragoi, G. Mittendorfer, C. Thanner, P. Lindner

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12