Blank Cover Image

Study on Displacement Measurement for Induced Strain Field Based on Digital Speckle Pattern Interferometry Method

Author(s):
Publication title:
Manufacturing and engineering developments : selected, peer reviewed papers from the 2nd International Conference on Innovation Manufacturing and Engineering Management (IMEM2012), December 14-16, 2012, Chongqing, Chaina
Title of ser.:
Applied mechanics and materials
Ser. no.:
273
Pub. Year:
2013
Page(from):
510
Page(to):
514
Pages:
5
Pub. info.:
Stafa-Zuerich: Trans Tech Publications
ISSN:
16609336
ISBN:
9781627480543 [1627480544]
Language:
English
Call no.:
A69500/273
Type:
Conference Proceedings

Similar Items:

R. Liu, X. Liu

Society of Photo-optical Instrumentation Engineers

Li,X.D., Deng,B., Shi,H.J.

SPIE-The International Society for Optical Engineering

L. Yang, Y. Wang, D. Thomas

Society of Photo-optical Instrumentation Engineers

Yuan, Kun, Li, Hui Xue, Tang, Huian, Zhu, Yuan Cheng

Trans Tech Publications

Y. Wan, P. Zhao, S.F. Cui, Y.F. Yang, L. Li

Trans Tech Publications

Liu, Yan Zhi, Liu, Yan, Tang, Hui An, Yuan, Kun

Trans Tech Publications

K. Ma, J. Wu, X. Chen, L. Xia, S. Tang

Society of Photo-optical Instrumentation Engineers

Zhang, Jian, Li, Hui Mei, Tang, Yan Feng, Wang, Qin Qin

Trans Tech Publications

Tang, Yi, Li, Yan, Zhang, Xiao, Jin, Tao

Trans Tech Publications

C. Tang, E. Li

Society of Photo-optical Instrumentation Engineers

B. Li, T. Liu, Y. Zhang

Society of Photo-optical Instrumentation Engineers

Jin,G.-C., Wu,Z., Bao,N.-K., Yao,X.-F.

SPIE-The International Society for Optical Engineering

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12