Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

Cu Filling Characteristics in Through-Si Via Holes by Electroless Plating with Addition of Inhibitors

Author(s):

Publication title:

Electronics Packaging 3

Title of ser.:

ECS transactions

Ser. no.:

16(22)

Pub. Year:

2009

Page(from):

27

Page(to):

32

Pages:

6

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781615672967 [1615672966]

Language:

English

Call no.:

E23400/16-17 [22]

Type:

Conference Proceedings

Details

TDL ID:	ZA00047186
Series ID:	PA00000034
Conf. info. (Name):	Meeting of the Electrochemical Society
Conf. info. (Number):	214th
Conf. info. (Venue):	Honoulu, Hawaii, USA
Conf. info. (Date):	2008.10.12-2008.10.17
Note for article:	214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA

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