Blech Effect in Copper Interconnects, Its Applications and Design Considerations
- Author(s):
- Publication title:
- Copper Interconnects, New Contact Metallurgies/Structures, and Low-k Inter-level Dielectrics, at 214th ECS Meeting, October 12-17, 2008, Honolulu, Hawaii, USA
- Title of ser.:
- ECS transactions
- Ser. no.:
- 16(19)
- Pub. Year:
- 2009
- Page(from):
- 41
- Page(to):
- 48
- Pages:
- 8
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781615672936 [1615672931]
- Language:
- English
- Call no.:
- E23400/16-17 [19]
- Type:
- Conference Proceedings
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