Impact of Thermal Processing on Silicon Wafer Surface Roughness
- Author(s):
- Publication title:
- Semiconductor Wafer Bonding 10: Science, Technology, and Applications
- Title of ser.:
- ECS transactions
- Ser. no.:
- 16(8)
- Pub. Year:
- 2008
- Page(from):
- 401
- Page(to):
- 405
- Pages:
- 5
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 19385862
- ISBN:
- 9781566776547 [1566776546]
- Language:
- English
- Call no.:
- E23400/16-8
- Type:
- Conference Proceedings
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