Fabrication and Characterization of High Resistivity SOI Wafers for RF Applications

Fabrication and Characterization of High Resistivity SOI Wafers for RF Applications

Author(s):

Publication title:

Semiconductor Wafer Bonding 10: Science, Technology, and Applications

Title of ser.:

ECS transactions

Ser. no.:

16(8)

Pub. Year:

2008

Page(from):

165

Page(to):

174

Pages:

10

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566776547 [1566776546]

Language:

English

Call no.:

E23400/16-8

Type:

Conference Proceedings

Details

TDL ID:	ZA00047171
Series ID:	PA00000034
Conf. info. (Name):	Pacific Rim Meeting, PRiME ; Meeting of ECS-The Electrochemical Society ; Fall Meeting of The Electrochemical Society of Japan
Conf. info. (Number):	2008 ; 214th ; 2008
Conf. info. (Venue):	Honolulu, Hawaii, USA
Conf. info. (Date):	2008.10.14-2008.10.16
Note for article:	Pacific Rim Meeting, PRiME 2008: joint International Meeting of the 214th Meeting of ECS-The Electrochemical Society, and the 2008 Fall Meeting of The Electrochemical Society of Japan

Similar Items:

1 Conference Proceedings Temperature dependence of RF losses in high-resistivity SOI substrates Lederer, D., Raskin, J. -P. Kluwer Academic Publishers	7 Conference Proceedings Characterization of SOI MOSFETs at microwave frequencies Gillon, R., Raskin, J.P., Vanhoenacker, D., Colinge, J.P., Dambrine, G. Electrochemical Society
2 Conference Proceedings On-Wafer Wideband Characterization: from Technology Improvements to Compact Models for Advanced MOS Devices J.-P Raskin, G. Pailloncy, D. Lederer ESA Publications Division	8 Conference Proceedings Application of Double Gate Graded-Channel SOI in MOSFET-C Balanced Structures R. T. Doria, M. A. Pavanello, A. Cerdeira, J. Raskin, D. Flandre Electrochemical Society
3 Conference Proceedings Thin Film Transfer for the Fabrication of Multiple Gate MOS Transistors B. Olbrechts, U. Södervall, S. Bengtsson, J. Raskin Electrochemical Society	9 Conference Proceedings Silicon-on-insulator (SOI) wafer fabrication for MEMS applications KotiReddy, B.R., Rao, P.R., DasGupta, A., Bhat, K.N.H. SPIE - The International Society of Optical Engineering
4 Conference Proceedings Stress release of PECVD oxide by RTA Charavel, R., Olbrechts, B., Raskin, J.-P. SPIE-The International Society for Optical Engineering	10 Conference Proceedings Fabrication of Planar Inductor on Low Resistivity Silicon Substrates for RF Applications Senapati,B., Bera,L.K., Banerjee,H.D., Maiti,C.K. SPIE - The International Society for Optical Engineering
5 Conference Proceedings N. DHalleweyn, J. Benson. M. Swanenbeig, W. Redman-Whizc A New Fully-Depleted SOI MOSFET Macro-Model Valid from DC to RF Raskin, B. Inilguez. J.P., Demeus, L., Neve, A., Goffioul, M., Simon, P., Vanhoenacker, D., Flandre, D. Electrochemical Society	11 Conference Proceedings Investigation of salicide processes for thin film SOI microwave applications Chen, J., Colinge, J.P., Flandre, D., Gillon, R., Raskin, J.P., Vanhoenacker, D. Electrochemical Society
6 Conference Proceedings Direct Wafer Bonding Enhanced by Ductile Layers Inserted Near the Interface B. Olbrechts, B. Lejeune, Y. Bertholet, T. Pardoen, J. Raskin Electrochemical Society	12 Conference Proceedings Fabrication and Characterization of Copper Oxide Resistive Memory Devices S.M. Bishop, B.D. Briggs, Z.P. Rice, S. Addepalli, N.R. McDonald, N.C. Cady Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12