“Seedless” Copper Electrochemical Deposition on Air Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters

“Seedless” Copper Electrochemical Deposition on Air Exposed TaN Barrier Layers with Pd and Ru Adhesion Promoters

Author(s):

Publication title:

Atomic layer deposition applications 2

Title of ser.:

ECS transactions

Ser. no.:

3(15)

Pub. Year:

2007

Page(from):

153

Page(to):

160

Pages:

8

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

19385862

ISBN:

9781566775427 [1566775426]

Language:

English

Call no.:

E23400/3-15

Type:

Conference Proceedings

Details

TDL ID:	ZA00047119
Series ID:	PA00000034
Conf. info. (Name):	Symposium on Atomic Layer Deposition Applications ; Meeting of the Electrochemical Society
Conf. info. (Number):	2nd ; 210th
Conf. info. (Venue):	Cancun, Mexico
Conf. info. (Date):	2006.10.29-2006.11.01
Note for article:	2nd Symposium on Atomic Layer Deposition Applications, 210th meeting of the Electrochemical Society, Moon Palace Resort, Cancun, Mexico, October 29 - November 1, 2006

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