Thermal stress effects of the interlayer between waveguide cores in buried channel optical waveguides

Thermal stress effects of the interlayer between waveguide cores in buried channel optical waveguides

Author(s):

H. Huang ( Huazhong Univ. of Science and Technology, China )
D. Huang ( Huazhong Univ. of Science and Technology, China )
W. Liu ( Huazhong Univ. of Science and Technology, China )
Z. Cheng ( Huazhong Univ. of Science and Technology, China )

Publication title:

"Passive Components and Fiber-based

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

7134

Pub. Year:

2008

Vol.:

2

Page(from):

71343N-1

Page(to):

71343N-10

Pages:

10

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819473745 [081947374X]

Language:

English

Call no.:

P63600/7134

Type:

Conference Proceedings

Details

TDL ID:	ZA00052765
Series ID:	PA00000029
Conf. info. (Name):	Asia Communications and Photonics : Passive Components and Fiber-based Devices
Conf. info. (Number):	2008 : 5th
Conf. info. (Venue):	Hangzhou, China
Conf. info. (Date):	2008.10.27-2008.10.30
Note for article:	Passive Components and Fiber-based Devices V, 27-30 October 2008, Hangzhou, China - Poster Session, 71343N, 7134-133

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