Optical method for testing of the packaging reliability of IC chips

Optical method for testing of the packaging reliability of IC chips

Author(s):

X. Xiong ( Guilin Univ. of Electronic-Technology, China )
L. Huang ( Guilin Univ. of Electronic-Technology, China )
Y. Lin ( Guilin Univ. of Electronic-Technology, China )

Publication title:

Fourth International Symposium on Precision Mechanical Measurements

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

7130

Pub. Year:

2008

Vol.:

2

Page(from):

71304D-1

Page(to):

71304D-6

Pages:

6

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819473646 [0819473642]

Language:

English

Call no.:

P63600/7130

Type:

Conference Proceedings

Details

TDL ID:	ZA00052761
Series ID:	PA00000029
Conf. info. (Name):	International Symposium on Precision Mechanical Measurements
Conf. info. (Number):	2008 : 4th
Conf. info. (Venue):	Hefei/Jiuhua Mountain, Anhui, China
Conf. info. (Date):	2008.08.25-2008.08.29
Note for article:	4th International Symposium on Precision Mechanical Measurements, 25-29 August 2008, Hefei/Jiuhua Mountain, Anhui, China - Session 8. Opto-Electronic Measurement and Image Processing, 71304D, 7130-156

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