Ion implantation as insoluble treatment for resist stacking process

Ion implantation as insoluble treatment for resist stacking process

Author(s):

H. Nakamura ( Toshiba Corp., Japan )
T. Shibata ( Toshiba Corp., Japan )
K. Rikimaru ( Toshiba Corp., Japan )
S. Ito ( Toshiba Corp., Japan )
S. Tanaka ( Toshiba Corp., Japan )

Publication title:

Advances in resist materials and processing technology XXV

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6923

Pub. Year:

2008

Vol.:

2

Page(from):

692322-1

Page(to):

692322-12

Pages:

12

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819471086 [0819471089]

Language:

English

Call no.:

P63600/6923

Type:

Conference Proceedings

Details

TDL ID:	ZA00052554
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Advances in Resist Materials and Processing Technology
Conf. info. (Number):	2008 : 25th
Conf. info. (Venue):	San Jose, California, USA
Conf. info. (Date):	2008.02.25-2008.02.27
Note for article:	Advances in resist materials and processing technology XXV, 25-27 February 2008, San Jose, California, USA. Posters: Materials and Processes for Double Patterning/Double Exposure, 692322, 6923-80

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