Advanced profile control and the impact of sidewall angle at gate etch for critical nodes

Advanced profile control and the impact of sidewall angle at gate etch for critical nodes

Author(s):

H. Lee ( Tokyo Electron America,INC., USA )
A. Ranjan ( Tokyo Electron America,INC., USA )
D. Prager ( Tokyo Electron America,INC., USA )
K. A. Bandy ( IBM Microelectronics, USA )
E. Meyette ( IBM Microelectronics, USA )

Publication title:

Metrology, inspection, and process control for microlithography XXII

Title of ser.:

Proceedings of SPIE - the International Society for Optical Engineering

Ser. no.:

6922

Pub. Year:

2008

Vol.:

1

Page(from):

69220T-1

Page(to):

69220T-13

Pages:

13

Pub. info.:

Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers

ISSN:

0277786X

ISBN:

9780819471079 [0819471070]

Language:

English

Call no.:

P63600/6922

Type:

Conference Proceedings

Details

TDL ID:	ZA00052553
Series ID:	PA00000029
Conf. info. (Name):	SPIE Advanced Lithography : Metrology, Inspection, and Process Control for Microlithography
Conf. info. (Number):	2008 : 22nd
Conf. info. (Venue):	San Jose, California, USA
Conf. info. (Date):	2008.02.25-2008.02.28
Note for article:	Metrology, inspection, and process control for microlithography XXII, San Jose, California, USA, 25-28 February 2008 - Session 6. Scatterometry I (69220T/6922-27)

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