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Integration of optical I/O with organic chip packages

Author(s):
Publication title:
Photonics packaging, integration, and interconnects VIII : 22-24 January 2008, San Jose, California, USA
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6899
Pub. Year:
2008
Page(from):
689912-1
Page(to):
689912-9
Pages:
9
Pub. info.:
Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819470744 [0819470740]
Language:
English
Call no.:
P63600/6899
Type:
Conference Proceedings

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