Patterning techniques for next generation IC's

Patterning techniques for next generation IC's

Author(s):: A. Balasinski ( Cypress Semiconductor, USA )
Publication title:: Microelectronics : design, technology, and packaging III : 5-7 December 2007, Canberra, Australia
Title of ser.:: Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:: 6798
Pub. Year:: 2008
Page(from):: 679803-1
Page(to):: 679803-7
Pages:: 7
Pub. info.:: Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:: 0277786X
ISBN:: 9780819469694 [0819469696]
Language:: English
Call no.:: P63600/6798
Type:: Conference Proceedings

Details

TDL ID:	ZA00052429
Series ID:	PA00000029
Conf. info. (Name):	Smart Materials, Nano-, and Micro- Smart Systems : Microelectronics
Conf. info. (Number):	2007 : 3rd
Conf. info. (Venue):	Canberra, Australia
Conf. info. (Date):	2007.12.05-2007.12.07
Note for article:	Microelectronics: Design, Technology, and Packaging III, 5-7 December 2007, Canberra, Australia - Session 1. Process Technologies (6798-02)

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