Blank Cover Image

Full-chip-based subresolution assist features correction for mask manufacturing

Author(s):
  • J.-M. Bang ( Samsung Electronics Co., Ltd., South Korea )
  • I. Masumoto ( Nippon Control System Co., Japan )
  • M.-K. Ji ( Samsung Electronics Co., Ltd., South Korea )
  • S.-H. Jang ( Samsung Electronics Co., Ltd., South Korea )
  • I. Aburatani ( Nippon Control System Co., Japan )
Publication title:
Photomask technology 2007
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
6730
Pub. Year:
2007
Vol.:
2
Page(from):
67302F-1
Page(to):
67302F-9
Pages:
9
Pub. info.:
Bellingham, Wash.: Society of Photo-optical Instrumentation Engineers
ISSN:
0277786X
ISBN:
9780819468871 [0819468878]
Language:
English
Call no.:
P63600/6730
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Shot based MRC flow by using full chip MRC tool

M. -K. Ji, S. -H. Jang, S. -J. Son, J. -H. Choi, S. -G. Woo, H. -K. Cho

SPIE - The International Society of Optical Engineering
7 Conference Proceedings Full-chip manufacturing reliability check and correction (MRC2): a first step toward design for manufacturability with low k1 lithography

Hsu, M., Laidig, T., Wampler, K. E., Hsu, S., Shi, X., Chen, J. F., Van Den Broeke, D.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Mask considerations for manufacturing assist features

Choi,J.-H., Cho,W.-I., Kim,B.-S., Yang,S.-H., Moon,S.-Y., Choi,S.-W., Han,W.-S., Sohn,J.-M.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Accuracy of diffused aerial image model for full-chip-level optical proximity correction

Hong,J.-S., Kim,H.-B., Yune,H.-S., Ahn,C.-N., Koo,Y.-M., Baik,K.-H.

SPIE - The International Society for Optical Engineering
3 Conference Proceedings Optimized distributed computing environment for mask data preparation [5992-41]

Ahn, B. -S., Bang, J. -M., Ji, M. -K., Kang, S., Jang, S. -H., Choi, Y. -H., Ki, W. -T., Choi, S. -W., Han, W. -S.

SPIE - The International Society of Optical Engineering
9 Conference Proceedings Model-based placement and optimization of subresolution assist features [6154-86]

Barnes, L. D., Painter, B. D., Melvin III, L. S.

SPIE - The International Society of Optical Engineering
4 Conference Proceedings Optimizing style options for subresolution assist features

Liebmann,L.W., Bruce,J.A., Chu,W., Cross,M., Graur,I.C., Krueger,J.J., Leipold,W.C., Mansfield,S.M., McGuire,A.E., …

SPIE-The International Society for Optical Engineering
10 Conference Proceedings A method for generating assist-features in full-chip scale and its application to contact layers of sub-70nm DRAM devices

D. Park, S. Kim, C. Hwang, S. Lee, H. Cho, J. Moon

SPIE - The International Society of Optical Engineering
5 Conference Proceedings Manufacturability evaluation of model-based OPC masks

Jang, S.-H., Zinn, S.Y., Ki, W.-T., Choi, J.-H., Jeon, C-U., Choi, S.-W., Yoon, H,-S., Sohn, J.M., Oh, Y.-H., Lee, …

SPIE-The International Society for Optical Engineering
11 Conference Proceedings Identification of subresolution assist features that are susceptible to imaging through process [6349-63]

Melvin III, L. S., Drapeau, M., Huang, J.

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Imaging contrast improvement for 160-nm line features using subresolution assist features with binary,six percent ternary attenuated phase-shift mask with …

Kachwala,N., Petersen,J.S., Chen,J.F., Canjemi,M., McCallum,M.

SPIE - The International Society for Optical Engineering
12 Conference Proceedings Fast and accurate 3D mask model for full-chip OPC and verification

P. Liu, Y. Cao, L. Chen, G. Chen, M. Feng, J. Jiang, H. Liu, S. Suh, S. Lee

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12