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Preliminary Reliability Evaluation of Flip Chip on Flex Interconnect Technology

Author(s):
Publication title:
Proceedings of the Third ESA Electronic Components Conference, EECC '97, ESTEC, Noordwijk, The Netherlands, 22-25 April 1997
Title of ser.:
ESA SP
Ser. no.:
395
Pub. Year:
1997
Page(from):
205
Page(to):
212
Pages:
8
Pub. info.:
Noordwijk, The Netherlands: European Space Agency
ISSN:
03796566
ISBN:
9789290922636 [929092263X]
Language:
English
Call no.:
E11690/395
Type:
Conference Proceedings

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