Thermal Stability of Low Resistance Ohmic Contacts Between Ti and Se-Passivated n-Type Si(001)

Thermal Stability of Low Resistance Ohmic Contacts Between Ti and Se-Passivated n-Type Si(001)

Author(s):

Publication title:

Interfaces in electronic materials : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-31

Pub. Year:

2003

Page(from):

316

Page(to):

325

Pages:

10

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774253 [156677425X]

Language:

English

Call no.:

E23400/200331

Type:

Conference Proceedings

Details

TDL ID:	ZA00051857
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Interfaces in Electronic Materials ; Joint Annual Meetings of the Electrochemical Society and the Electronics Division of the American Ceramic Society
Conf. info. (Number):	2003
Conf. info. (Venue):	Orlando, FL
Conf. info. (Date):	2003.10.12-2003.10.16

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