Process and Material Challenges Associated with the Next Generation of LTCC Based Products

Process and Material Challenges Associated with the Next Generation of LTCC Based Products

Author(s):

E. Elvey

Publication title:

Low temperature electronics and low temperature cofired ceramic based electronic devices : proceedings of the seventh International Symposium on Low Temperature Electronics and the International Symposium on Low Temperature Cofired CeramicBbased Electronic Devices

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

2003-27

Pub. Year:

2003

Page(from):

141

Page(to):

155

Pages:

15

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566774123 [1566774128]

Language:

English

Call no.:

E23400/200327

Type:

Conference Proceedings

Details

TDL ID:	ZA00051854
Series ID:	PA00000028
Conf. info. (Name):	Seventh International Symposium on Low Temperature Electronics ; International Symposium on Low Temperature Cofired Ceramic Based Electronic Devices ; Annual Meeting of the Electrochemical Society
Conf. info. (Number):	2003
Conf. info. (Venue):	Orlando, FL
Conf. info. (Date):	2003.10.12-2003.10.16

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